[Eug-lug] Re: Concurrency
walter fry
kd7kpa at hotmail.com
Tue Jan 11 10:02:59 PST 2005
At last something I can understand,,In the late 1960's I heard a comment
that the next great breakthrough would be three dimensional chip
architecture, at that time it was thought that heat dissipation would become
the biggest hurdle
>What causes most of the slowdown in going from CPU to main memory is
>the pads and PC board. On chip signals have orders of magnitude less
>capacitance and so can go at least an order of magnitude faster.
>
>One technology that is being considered is optical interconnect. That
>would provide a tremendous speedup to this pathway. The technology
>isn't ready yet. I don't know how long it will take to appear.
>
>But once you have optical interconnect, it can be used on chip as
>well as off chip. Recall that Herb indicated the speed limit of
>current processors is basically caused by interconnect. Optical
>interconnect changes that and greatly reduces the speed cost of long
>distance signaling
Perhaps vertical integration is waiting for optical interconnects, which
would probably be GaAs due to higher speed than Si as well as higher
efficiencies
WF
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